Sr. Semiconductor Packaging
Engineer
Benefits - Full
Relocation
Assistance Available - Yes
Bonus
Eligible - Yes
Interview Travel Reimbursed - Yes
The motivated jobholder will support
the growth of the electronic applications in the United States, more specifically
the support of innovative front-end applications for the Semiconductor
Packaging Market with focus on Fan Out applications where application
development and application engineering activities are involved.
The position will be based in either CA
or MI with frequent travel between the two. Relocation Assistance is provided
to those that qualify.
PRIMARY RESPONSIBILITIES
- This role will include hands-on lab
work, reporting in CRM, literature search, extensive contacts and presentations
to internal/external customers, internal and external technical publications.
- Troubleshooting is another important
task related to potential reliability and quality problems at customers.
- He/she will work on new applications
in fields like innovative packaging solutions especially Fan Out package
solutions for the Semiconductor Market using different application methods like
spin coating, stencil/screen printing, spraying, molding,
..... for dielectric, bonding and moldable
materials.
- The job responsibility includes the
successful integration of these materials in the different customer
applications. His extensive contacts with customers will allow that customers
can become successful with Companyf solutions.
- This requires that the candidate has
in depth understanding of different Fan Out packages and understand the
integration tradeoffs.
- He/she generates data to be able to
share the generated know-how with our customers in ASEAN area and providing the
proper technical sales tools and training to other Application Engineering
colleagues.
- Both responsibilities require
ability to develop of partnerships like research institutions, film
manufactures, chemical suppliers and equipment vendors in collaboration with
other functions.
ADDITIONAL DUTIES &
RESPONSIBILITIES
- The successful candidate his primary
focus is Application Development for new products in Fan Out packages and
responsible to work with innovative customers and other partner suppliers to
assure the products are meeting the needs of the customer and the application.
- This position will require
interaction with other functions like product development, sales and marketing
colleagues to share and acquire knowledge.
KNOWLEDGE, SKILLS, & ABILITIES
The ideal candidate:
- has proven Fan Out
package expertise
- has wafer level materials experience
like temporary bonding materials, photopatternable
dielectric materials, and innovative device packaging integration experience
- is hands-on oriented, willing to
work in the lab and has an analytical mind (troubleshooting)
- has excellent organization skills:
work efficiency and documentation
- is able to manage several projects
at the same time
- has good skills in MS Word, Excel,
PowerPoint and Outlook
- has knowledge of Design of Experiments
is an asset
- has knowledge of Finite Element
Analysis is an asset
- Will have good communication skills
- is creative, an excellent team
player
- is proactive and shows initiative.
- has excellent English language
skills (written, read and spoken); any other language is an asset*
EDUCATION & EXPERIENCE
- MsC(PhD) in material
science, (micro)electronics and/or chemical engineering.
The individual in this environment
often works at a fast pace with minimum to moderate supervision. The requirements
of the business may cause frequent interruptions and changing priorities.
Must be able to:
* Complete multiple tasks and see them
through completion.
* Work independently, with excellent
time management and judgment in prioritization skills.
* React rapidly to evolving issues and
dynamic scheduling situations with utmost discretion.
* Collaborate effectively in team,
department, or other work group situations.
* Travel domestically /
internationally as required.
Visa
Candidates Considered - Yes
The
Candidate
7+ to 10 years of experience
Minimum Education - Master's Degree
Willingness
to Travel – Often