Refurbishment & Field Service Engineer, Bonders and Aligners

SUMMARY: This position is responsible for the repair and refurbishment of Bonder and Mask Aligner equipment. 

ESSENTIAL DUTIES AND RESPONSIBILITIES:


Core duties and responsibilities include the following. Other duties may be assigned.

• Performs electrical and mechanical troubleshooting for semiconductor equipment in a timely manner and develops alternative solutions.

• Must be able to research and find documentation on older tools.

• Perform equipment disassembly, cleaning, reassembly, and setup.

• Maintains accurate records and logs of work performed, modifications, calibration, adjustments and parts inventory.

• Maintains clean and organized workspace.

• Observes safety and security procedures and uses equipment and materials properly.

• Experience with mechanical and electro optical components.

• Experience with Vacuum systems preferred.

• May perform equipment installations and de-installations at customer facilities.

• May performs Field Service as needed.

EDUCATION AND/OR EXPERIENCE


Two year electronics degree or five years wafer fab equivalent work experience required.

• BSME or BSEE preferred.

• Trouble shooting and component board level repair a plus.

• Precision mechanical repair a plus.

• Trained on EVG and/or Suss Bonder and Aligners or similar semiconductor wafer equipment  

OTHER SKILLS AND ABILITIES:

• Skilled at performing work with high attention to detail, meticulous and quality focused.

• Demonstrated ability to work independently from general instructions.

• Excellent oral and written communication skills required.

• Able to deal with frequent changes, delays or unexpected events.

• Commits to long hours of work when necessary to reach goals.

• Must possess valid U.S. Passport, and be able to travel on short notice. Up to 30% travel may be required.