Refurbishment & Field Service Engineer, Bonders and Aligners


SUMMARY: This position is responsible for the repair and refurbishment of Bonder and Mask Aligner equipment. 


Core duties and responsibilities include the following. Other duties may be assigned.

Performs electrical and mechanical troubleshooting for semiconductor equipment in a timely manner and develops alternative solutions.

Must be able to research and find documentation on older tools.

Perform equipment disassembly, cleaning, reassembly, and setup.

Maintains accurate records and logs of work performed, modifications, calibration, adjustments and parts inventory.

Maintains clean and organized workspace.

Observes safety and security procedures and uses equipment and materials properly.

Experience with mechanical and electro optical components.

Experience with Vacuum systems preferred.

May perform equipment installations and de-installations at customer facilities.

May performs Field Service as needed.


Two year electronics degree or five years wafer fab equivalent work experience required.

BSME or BSEE preferred.

Trouble shooting and component board level repair a plus.

Precision mechanical repair a plus.

Trained on EVG and/or Suss Bonder and Aligners or similar semiconductor wafer equipment  


Skilled at performing work with high attention to detail, meticulous and quality focused.

Demonstrated ability to work independently from general instructions.

Excellent oral and written communication skills required.

Able to deal with frequent changes, delays or unexpected events.

Commits to long hours of work when necessary to reach goals.

Must possess valid U.S. Passport, and be able to travel on short notice. Up to 30% travel may be required.


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